|
Paul K. Chu (朱劍豪) is a specialist in plasma surface modification and materials science. He is Chair Professor of Materials Engineering at City University of Hong Kong. ==Biography== He received his BS in mathematics (cum laude) from The Ohio State University in 1977 and his MS and PhD in chemistry from Cornell University in 1979 and 1982, respectively. He is Fellow of the American Physical Society (APS), American Vacuum Society (AVS), Institute of Electrical and Electronics Engineers,〔(New IEEE Fellows 2003 ), retrieved 24 January 2007〕 (IEEE), and Materials Research Society (MRS). He is the recipient of the 2007 IEEE NPSS Merit Award which is the most prestigious award given by IEEE in the areas of nuclear and plasma sciences, 2008 MRS (Taiwan) JW Mayer Lectureship, and 2011 Shanghai Natural Science First Class Award (上海自然科學一等獎). He is Fellow of the Hong Kong Academy of Engineering Sciences (香港工程科學院院士) and Hong Kong Institution of Engineers. He is chairman of the International Plasma-Based Ion Implantation Executive Committee which organises the biennial International Workshop on Plasma-Based Ion Implantation and Deposition (PBII&D) and a member of the Ion Implantation Technology (IIT) International Committee that organises the biennial International Conference on Ion Implantation Technology as well as the IEEE Nuclear and Plasma Science Society Fellow Evaluation Committee. He holds or has held advisory or visiting professorship in 14 universities and research institutes in China, including the Institute of Microelectronics in Peking University, Department of Physics in Nanjing University, and Shanghai Institute of Ceramics of the Chinese Academy of Sciences. He has established a joint PhD program with the University of Sydney in Australia. Prof. Chu is associate editor of Materials Science and Engineering: Reports, supervising senior editor of IEEE Transactions on Plasma Science, and a member of the editorial board of Biomaterials, Advanced Materials Interfaces, Surface and Interface Analysis, Surface and Coatings Technology, Recent Patents on Materials Science, International Journal of Molecular Engineering, and Materials and Surfaces for Biocompatible Systems. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Paul K. Chu」の詳細全文を読む スポンサード リンク
|